Author(s)

ZiQin Huang

Affiliation(s)

Mathematics and Applied Mathematics, Xi'an Jiaotong-Liverpool University, Suzhou 215000, Jiangsu, China.

Corresponding Author

ZiQin Huang

ABSTRACT

Accelerated life testing (ALT) is an efficient reliability evaluation method with significant application value in solder joint life prediction for electronic packaging. This paper systematically reviews the theoretical basis and practical applications of ALT in solder joint life prediction. It analyzes the main failure mechanisms such as thermomechanical fatigue, electromigration, and creep, discusses the principles and applicability of accelerated models such as Arrhenius, Coffin-Manson, and Norris-Landzberg, and elaborates on the calculation methods of acceleration factors and test design optimization considering stress types such as temperature, vibration, and humidity. Literature case studies show that ALT, by simulating long-term service conditions, can rapidly reveal the microstructural degradation characteristics of solder joints, significantly shortening the test cycle and improving prediction accuracy. The study further points out that combining data-driven methods with multi-physics coupling models is a promising future direction, effectively addressing challenges arising from multiple variable interactions and complex environments, and providing a scientific basis for the design of highly reliable electronic products.

KEYWORDS

Accelerated life testing; Solder joint reliability; Thermomechanical fatigue; Acceleration factor; Lead-free solder

CITE THIS PAPER

ZiQin Huang. Application of accelerated life testing in solder joint life prediction. Journal of Manufacturing Science and Mechanical Engineering. 2025, 3(1): 33-36. DOI: https://doi.org/10.61784/msme3018.

REFERENCES

[1] Qian Z, Liu S. On the life prediction and accelerated testing of solder joints. The International Journal of Microcircuits and Electronic Packaging, 1999, 22(4): 288-304.

[2] Mi J, Li YF, Yang YJ, et al. Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using Type-I censored data. The Scientific World Journal, 2014, 2014: 807693.

[3] Lederer M, Betzwar Kotas A, Khatibi G. Lifetime modeling of solder joints based on accelerated mechanical testing and finite element analysis. Power Electronic Devices and Components, 2023, 5: 100034.

[4] Lederer M, Betzwar Kotas A, Khatibi G. A lifetime assessment and prediction method for large area solder joints. Microelectronics Reliability, 2020, 114: 1-7.

[5] Samavatian V, Fotuhi-Firuzabad M, Samavatian M, et al. Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics. Scientific Reports, 2020, 10: 14821.

[6] Che FX, Pang HL, Ong YC, et al. Assessment of acceleration models used for BGA solder joint reliability studies. Microelectronics Reliability, 2009, 49(7): 754-760.

[7] Suhir E. Accelerated life testing (ALT) in microelectronics and photonics: Its role, attributes, challenges, pitfalls, and interaction with qualification tests. Microelectronics Reliability, 2003, 43(4): 509-520.

[8] Badri SH, Lall P. Reliability modeling of the fatigue life of lead-free solder joints at different testing conditions using a modified power law model. Scientific Reports, 2023, 13(1): 2284.

[9] Tan L, Chen H, Ma B, et al. A state-of-the-art review of fatigue life prediction models for solder joint in electronics. Journal of Electronic Packaging, 2019, 141(4): 040802.

[10] Engelmaier W. Solder joint reliability, theory and applications. Soldering & Surface Mount Technology, 1991, 3(1): 14-20.

[11] Li L, Du X, Chen J, et al. Thermal fatigue failure of micro-solder joints in electronic packaging devices: A review. Materials, 2024, 17(10): 2365.

[12] Depiver JA, Mallik S, Amalu EH. Solder joint failures under thermo-mechanical loading conditions - a review. Advances in Materials and Processing Technologies, 2021.

[13] Alakayleh A, Jiang Z, Xie R. Interpretable data-driven framework for predicting the life of lead-free solder materials under thermal cycling. Journal of Intelligent Manufacturing, 2025.

[14] Al Athamneh R, Abueed M, Bani Hani D, et al. Effect of aging on SAC305 solder joints reliability in accelerated fatigue shear test. Proceedings of SMTA International, 2018.

[15] Ghaffarian R, Evans JW. Enabling more than Moore: accelerated reliability testing and risk analysis for advanced electronics packaging. Proceedings of the 2014 IEEE Accelerated Stress Testing and Reliability Conference (ASTR), 2014: 1-7.