Author(s)

Yang Wu

Affiliation(s)

HSBC Bank (China) Limited, Shanghai 200120, China.

Corresponding Author

Yang Wu

ABSTRACT

Trade finance is the backbone of global commerce but remains technologically fragmented, leading to inefficiency, risk, and high costs. This study analyzes the technical and institutional barriers to interoperability among blockchain trade finance platforms, evaluates credit recognition mechanisms, and proposes a path toward seamless, secure financial integration. Comprehensive case studies from Asia and global consortia demonstrate that interoperability and automated credit recognition can reduce costs by 73–89%, settlement time from days to seconds, and significantly improve access for SMEs. Drawing on empirical data from eTradeConnect, mBridge, Marco Polo, and PBCTFP, we present a three-layer architectural framework integrating technical, institutional, and regulatory dimensions. The paper presents a phased implementation roadmap through 2028 and identifies policy recommendations for central banks, financial regulators, and industry consortia seeking to develop robust interoperability infrastructure.

KEYWORDS

Blockchain interoperability; Trade finance; Credit recognition; Financial infrastructure

CITE THIS PAPER

Yang Wu. Interoperability technologies and credit recognition mechanisms among trade finance blockchain networks. Journal of Trends in Financial and Economics. 2025, 2(4): 25-33. DOI: https://doi.org/10.61784/jtfe3062.

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